Leti has used an active interposer as a modular and energy-efficient integration platform that can integrate large-scale chiplet-based computing systems such as HPC and big-data applications the technique has been demonstrated on a 220Gops processor.
Isscc 2020. SAN FRANCISCO This years processor session at the ISSCC led off with two presentations by AMD for the first time followed by presentations from Samsung and MediaTek talking about their latest 5G smart phone chips a. The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. Chiplets 5G and Automotive Processors.
ISSCC 19803 Laurel Valley Place Montgomery Village MD 20886 USA. On Monday February 17th ISSCC 2020 at 830 am offers four plenary papers on the theme. 1 732 981 0060.
2020 Date Added to IEEE Xplore. By Kevin Krewell principal analyst Tirias Research 02242020 0. Integrated Circuits Powering the AI ERA.
On Sunday February 16th the day before the official opening of the Conference ISSCC 2020 offers. 978-1-7281-3205-1 Print on DemandPoD ISBN. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency and to network with leading experts Learn More.
The Social Hour held in conjunction with Book Displays and Author Interviews will also include a Demonstration Session. A 240192Pixel 10fps 70klux 225m-Range Automotive LiDAR SoC Using a 40ch 00036mm2 VoltageTime Dual-Data-Converter-Based AFE. Specifications to Evaluate Metrics o Accuracy n Difficulty of dataset andor task should be considered n Difficult tasks typically require more complex DNN models o Throughput n Number of PEs with utilization not just peak performance n Runtime for running specific DNN models o Latency n Batch size used in evaluation o Energy and Power n Power consumption for.
ISSCC 2020 February 19 2020 130 PM Figure 2711. ISSCC 2023 Call for Papers. Architectures Hot Chips 31 IEDM 2019 ISSCC 2020 A Look at Intel Lakefield.